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  v ishay siliconix spice device model si4896d y n-channel 80-v (d-s) mosfet characteristics ? n-channel vertical dmos ? macro model (subcircuit model) ? level 3 mos ? apply for both linear and sw itching application ? accurate over the ? 55 to 125 c temperature range ? model the gate charge, transient, and diode reverse recovery characteristics description the attached spice model descri bes the ty pical electrical characteristics of the n-channel ve rtical dmos. the subcircuit model is extracted and optimized over the ? 55 to 125 c temperature ranges under the puls ed 0-v to 5-v gate drive. the saturated output impedance is best fit at the gate bias near the threshold voltage. a novel gate-to-drain feedback capac itance netw o rk is used to model the gate charge characteristics w h ile avoiding convergence difficulties of the sw itched c gd model. all model parameter values are optimized to provide a best fit to the m easured electrical data and are not intended as an exact phy sical interpretation of the device. subcircuit model schematic this document is intended as a spice modeling guideline and does not constitute a commercial product data sheet. designers sho uld refer to the appropriate data sheet of the same number fo r guaranteed specific ation limits. 1 www. vi s h a y .com document number: 71562 s-60072 ? rev . b , 23-jan-06
v ishay siliconix spice device model si4896dy specificat ions (t j = 2 5 c unless ot herwise not e d) pa ra me te r s y m b o l te s t c o n d i t i o n ty pic a l u n i t static gate threshold voltage v gs(t h ) v ds = v gs , i d = 250 a 2 . 6 3 v on-state drain current a i d(o n ) v ds 5 v, v gs = 10 v 3 1 9 a v gs = 10 v, i d = 10 a 0.0127 drain-source on-state resistance a r d s (on) v gs = 6 v, i d = 8 a 0.0175 ? forw ard transconductance a g fs v ds = 15 v, i d = 10 a 24 s diode forw ard voltage a v sd i s = 2.8 a, v gs = 0 v 0.83 v dy namic b total gate charge q g 3 7 . 6 gate-source charge q gs 7 . 5 gate-drain charge q gd v ds = 40 v, v gs = 10 v, i d = 10 a 11 nc turn-on delay time t d(on) 1 8 ris e time t r 2 2 turn-of f delay time t d(off) 3 0 fall time t f v dd = 40 v, r l = 40 ? i d ? 1 a, v gen = 10 v, r g = 6 ? 45 source-drain rev e rse recov e ry time t rr i f = 2.8 a, di/dt = 100 a/ s 40 ns not e s a. pulse test; pulse w i dth 300 s, duty cy cle 2%. b. guaranteed by design, not s ubject to production testing. 2 www. vi s h a y .com document number: 71562 s-60072 ? rev . b, 23-jan-06
v ishay siliconix spice device model si4896d y comparison of model wit h measured dat a (t j =2 5 c unless ot herwise not e d) 3 www. vi s h a y .com document number: 71562 s-60072 ? rev . b , 23-jan-06
document number: 91000 www.vishay.com revision: 18-jul-08 1 disclaimer legal disclaimer notice vishay all product specifications and data are subject to change without notice. vishay intertechnology, inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, ?vishay?), disclaim any and all liability fo r any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. vishay disclaims any and all li ability arising out of the use or application of any product describ ed herein or of any information provided herein to the maximum extent permit ted by law. the product specifications do not expand or otherwise modify vishay?s terms and conditions of purcha se, including but not limited to the warranty expressed therein, which apply to these products. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of vishay. the products shown herein are not designed for use in medi cal, life-saving, or life-sustaining applications unless otherwise expressly indicated. customers using or selling vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify vishay for any damages arising or resulting from such use or sale. please contact authorized vishay personnel to obtain written terms and conditions regarding products designed for such applications. product names and markings noted herein may be trademarks of their respective owners.


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